Continuous solder paste dispenser
US4604966A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 10, 1985 |
| Grant date | Aug 12, 1986 |
| Priority date | — |
| Expiry date | Oct 10, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0134
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Apparatus for applying solder paste to printed circuit boards ("PCB's") in a continuous operation. A drum containing solder paste is positioned over a work station and has an outlet slot through which the solder paste can be discharged onto the surface of a PCB as it advances through the work station. A stencil formed with a desired pattern for application of the solder paste to the PCB is rotatably mounted on the outer surface of the drum and overlies the outlet slot. Gravity, machine vibration, and, if desired, air pressure are effective to discharge the solder paste onto the PCB with the aid of a resilient squeegee pad adjacent the outlet slot. A drive mechanism directly couples the translational movement of the PCB through the work station with the rotational movement of the stencil at the work station.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.