Device for attaching modular electronic components to or removing them from an insulative substrate
US4605152A · kind A · utility
17Cited by
3References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 24, 1984 |
| Grant date | Aug 12, 1986 |
| Priority date | — |
| Expiry date | Feb 24, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0486
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device is disclosed for attaching to or removing modular electronic components from a substrate which is adjustably positioned beneath a heater means delivering a flow of uniformly heated air. The heated air is directed to the sides of the component to melt solder associated with terminals thereon by a series of changable nozzles which can be moved into or out of registry with the component. Vacuum means is also provided for contacting the component to position it on or remove it from the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.