Solder-bearing leads
US4605278A · kind A · utility
21Cited by
3References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 24, 1985 |
| Grant date | Aug 12, 1986 |
| Priority date | — |
| Expiry date | May 24, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49208
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A solder-bearing lead useful as a terminal or contact which may be fabricated by rapid progressive stamping techniques is disclosed in which side ears are formed on the contact blank, and then bent upwardly out of their initial plane. These ears are formed to hold a solder mass in a position where the solder can confront the conductive area to which the lead is to be soldered, permitting convenient surface mounting of components having such leads, on a substrate, and permitting convenient connection of terminals to other components or substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.