Methods of and apparatus for forming conductive patterns on a substrate
US4606788A · kind A · utility
Inventor
Key dates
| Filing date | Apr 3, 1985 |
| Grant date | Aug 19, 1986 |
| Priority date | — |
| Expiry date | Apr 3, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12493
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming an electrically conductive pattern on a substrate includes the steps of forming a layer of gold on an electrically insulating substrate and coating the gold layer with a photo-resist. The resist is exposed to light through a photo mask and the exposed portions of the photo-resist are selectively removed by etching. The now exposed parts of the gold layer are coated with copper and the remaining photo-resist is removed. The exposed parts of the gold layer and the copper are subjected to molten tin which simultaneously acts to dissolve the exposed parts of the gold layer and to form an electrically conductive coating on the copper. The process enables the formation of a precise conductive pattern with enhanced reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.