Curable compositions based on epoxy resins

US4607069A · kind A · utility

Assignee

• BASF SE

Inventors

• Helmut Tesch · Bad Dürkheim, DE
• Manfred Heym · Bad Dürkheim, DE
• Walter Doerflinger · Espelkamp, DE
• Herbert Stutz · Karlsruhe, DE
• Peter Neumann · Wiesloch, DE
• Dietmar Nissen · Heidelberg, DE
• Gerhard Schaefer · Heidelberg, DE

Key dates

• Filing date: Jul 3, 1985
• Grant date: Aug 19, 1986
• Expiry date: Jul 3, 2005

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08J2363/00
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

A solvent-free curable composition has a long shelf life and consists of PA0 A 100 parts by weight of an epoxy resin and PA0 B from 10 to 100 parts by weight of, as a curing agent for the epoxy resin, an aromatic diamine containing ##STR1## groups, with or without C from 0.01 to 5 parts by weight of an accelerator, the curing agent for the epoxy resin being finely dispersed in the latter and preferably having a particle size of less than 10 .mu.m. The preferred epoxy resin curing agent is 4,4'-diaminodiphenyl ketone. The curable composition is used in particular for the preparation of fiber-reinforced materials.