Patent · US Expired

Semiconductor element with disk-shaped housing

US4607275A · kind A · utility

4Cited by

4References

19Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Herbert Vogt · Munich, DE
Werner Egerbacher · Munich, DE
Dieter Wunderlich · Olching, DE
Werner Mitzkus · Munich, DE

Key dates

Filing date	Mar 6, 1984
Grant date	Aug 19, 1986
Priority date	—
Expiry date	Mar 6, 2004

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1301
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A disk-shaped housing for a semiconductor element comprising a cup (1) of insulating material with an opening (2) at the bottom. Through this opening (2) passes a contact surface (4) of one of two plate type connecting bodies (3), between which lies a pressure-contacted semiconductor body (14). Both connecting bodies (3, 5) comprise radially and axially oriented seal surfaces (8, 9; 11, 12), against which there abuts under pressure an elastic ring (13) which surrounds the semiconductor body. The cup is filled with sealing compound (18); the semiconductor body is thus protected against penetration of the sealing compound.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.