Semiconductor assembly employing noneutectic alloy for heat dissipation
US4607277A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 20, 1984 |
| Grant date | Aug 19, 1986 |
| Priority date | — |
| Expiry date | Sep 20, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01322
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling means for a circuit chip device employs a noneutectic metal alloy to form a low thermal resistance bridging interface between the surface of the chip device and a heat sink. The alloy has a solidus-liquidus temperature range such that the solidus is slightly below the maximum operating temperature of the chip, and thus has the capability to reestablish and maintain the interface at a low thermal resistance if stressed during circuit operation, even with a low current load at the interface of the chip device and the heat sink. In addition to the chip interface, the above cooling means is also used at other interfacial regions of the heat sink, dependent on design, to achieve very low thermal resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.