Height measuring system
US4607525A · kind A · utility
23Cited by
11References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 1984 |
| Grant date | Aug 26, 1986 |
| Priority date | — |
| Expiry date | Oct 9, 2004 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B13/065
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention of this disclosure is a profiling and testing system that uses an air probe to determine the contour of a wafer containing a plurality of dies so that an electrical sensor may automatically step from die to die and test the completed dies in the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.