Heat sink for integrated circuit package
US4607685A · kind A · utility
54Cited by
3References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 6, 1984 |
| Grant date | Aug 26, 1986 |
| Priority date | — |
| Expiry date | Jul 6, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat exchange attachment device for integrated circuits is presented which eliminates any need for contact with adhesive pastes or solder. A snap-on holding piece permits a finned cooling unit to be threaded through an aluminum base plate attached to the pin grid array package so that a threaded shaft of the cooling unit may be screwed into adjustable contact with a beryllium oxide disk mounted on the integrated circuit package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.