Pb-Sn-Sb-Ag solder alloy
US4608230A · kind A · utility
1Cited by
3References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 4, 1985 |
| Grant date | Aug 26, 1986 |
| Priority date | — |
| Expiry date | Mar 4, 2005 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22C11/06
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A solder alloy which is particularly effective for use in automotive radiator applications comprises 87.5%-96.5% lead, 3%-10% tin, 0.5%-2.0% antimony, and 0-0.5% silver. The solder has high mechanical strength, is resistant to galvanic corrosion, and is readily solderable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.