Method of manufacturing a memory FET with shorted source and drain region
US4608748A · kind A · utility
15Cited by
10References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 1982 |
| Grant date | Sep 2, 1986 |
| Priority date | — |
| Expiry date | Jun 18, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B20/00
Abstract
A method of manufacturing a semiconductor device having a plurality of MOS transistors which construct a memory section. After forming a plurality of MOS transistors on a semiconductor substrate, source regions and drain regions of given MOS transistors are shorted in accordance with a requested program. An insulating film is subsequently formed on the MOS transistors and an interconnection wiring layer is further formed thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.