Patent · US Expired

Method of manufacturing a memory FET with shorted source and drain region

US4608748A · kind A · utility

15Cited by
10References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 18, 1982
Grant dateSep 2, 1986
Priority date
Expiry dateJun 18, 2002

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10B20/00

Abstract

A method of manufacturing a semiconductor device having a plurality of MOS transistors which construct a memory section. After forming a plurality of MOS transistors on a semiconductor substrate, source regions and drain regions of given MOS transistors are shorted in accordance with a requested program. An insulating film is subsequently formed on the MOS transistors and an interconnection wiring layer is further formed thereon.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.