Process of heat treating copper film on ceramic body and heat treating apparatus therefor
US4609409A · kind A · utility
3Cited by
13References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 9, 1984 |
| Grant date | Sep 2, 1986 |
| Priority date | — |
| Expiry date | Nov 9, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G13/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A process for metallizing a copper film comprising the step of heat treating a copper film formed by an electroless plating process as opposing electrodes of a ceramic capacitor. The process comprises the steps of placing a ceramic body having a copper film formed on the surface thereof by an electroless plating process within a container sealing the same from the external atmosphere and maintaining constant the internal atmosphere, and heating the container maintaining the surrounding of the container in an inert atmosphere.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.