Power semiconductor device with O-ring seal
US4609937A · kind A · utility
5Cited by
6References
11Claims
0Family size
Inventors
Key dates
| Filing date | Apr 26, 1985 |
| Grant date | Sep 2, 1986 |
| Priority date | — |
| Expiry date | Apr 26, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1301
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power semiconductor device dispensed with soldering and useful for fork lifts and etc., wherein at least one O-ring is provided between the inner wall of case housing at least one semiconductor element structure and outer periphery of a member disposed on the semiconductor element structure inside said case so as to hermetically seal the semiconductor element structure from external atmosphere.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.