Method of making high density dielectric isolated gate MOS transistor
US4610078A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 1984 |
| Grant date | Sep 9, 1986 |
| Priority date | — |
| Expiry date | Dec 21, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S148/082
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is disclosed a method of manufacturing a semiconductor device comprising a step of forming an isolation film having a patterned hole on a major surface of a semiconductor substrate of a P conductivity type, the wall of the isolation film defining the patterned hole having a large step, a step of forming a polysilicon layer on the major surface of the structure, a step of forming a first interlaid SiO.sub.2 layer on the polysilicon layer, a step of patterning the SiO.sub.2 layer and polysilicon layer using reactive ion etching process, thereby forming on the region of the substrate a gate electrode and a first SiO.sub.2 film superposed thereon, the continuous side wall of the gate electrode and first SiO.sub.2 film having a large step, a step of implanting an impurity ion into the substrate using the first SiO.sub.2 film as a mask, thereby forming an impurity diffused region of an N conductivity type in the substrate, a step of forming a second interlaid SiO.sub.2 layer on the major surface of the structure, and a step of applying reactive ion etching to the second SiO.sub.2 layer, thereby forming a contact hole in the second SiO.sub.2 layer leading to the impurity diffused re…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.