Method of dicing a semiconductor wafer
US4610079A · kind A · utility
70Cited by
15References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 1985 |
| Grant date | Sep 9, 1986 |
| Priority date | — |
| Expiry date | Feb 26, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/12
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of dicing a semiconductor wafer in which a physical discontinuity is formed on the surface of the wafer on both sides of a dicing line to limit the spreading of cracks and chips generated during dicing. Thereafter, the semiconductor wafer is diced to separate the pellets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.