Conductive resinous composites
US4610808A · kind A · utility
39Cited by
9References
21Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 31, 1983 |
| Grant date | Sep 9, 1986 |
| Priority date | — |
| Expiry date | May 31, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B1/22
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention is directed to resinous compositions which are generally metal-filled and which also contain hard filler materials. This combination produces unexpectedly better electrical conductivity than metal-filled material without the hard filler materials. Meanwhile there can be retained the resinous composition's ability to be quickly fabricated by simple molding technique into structurally sound rigid articles which are electrically conductive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.