Novel poly(ester-amide) hot-melt adhesives
US4611051A · kind A · utility
153Cited by
5References
4Claims
0Family size
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Key dates
| Filing date | Dec 31, 1985 |
| Grant date | Sep 9, 1986 |
| Priority date | — |
| Expiry date | Dec 31, 2005 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G69/34
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
In the present invention, poly(ester-amide) hot-melt adhesives are prepared from condensation of a mixture of polymeric fatty acids and 1,18-octadecanedicarboxylic acid, and a substantially equivalent proportion of a mixture of a polyamine and a polyol.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.