Compression molding a charge using vacuum
US4612149A · kind A · utility
26Cited by
2References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 13, 1984 |
| Grant date | Sep 16, 1986 |
| Priority date | — |
| Expiry date | Aug 13, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S264/64
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method is disclosed for making a part with a smooth surface, such as an exterior automotive body panel, by compression molding a charge containing a curable resin. The charge is placed on the molding surface of one of the dies so that the charge covers 40%-80% of the surface area of the molding surface. The molds are moved to a partially closed position and the mold cavity is quickly evacuated. The mold is then closed so that the dies compress the charge to cause it to fill the mold cavity and, after the resin cures, the part is removed from the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.