Process for planarizing a substrate
US4612210A · kind A · utility
8Cited by
8References
8Claims
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Key dates
| Filing date | Jul 25, 1985 |
| Grant date | Sep 16, 1986 |
| Priority date | — |
| Expiry date | Jul 25, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A surface coating of high glass temperature and superior mechanical properties along with excellent planarization and gap filling is used to coat substrates. The coating comprises a polyamide alkyl ester from a pyromellitic alkyl diester and a para-linked aromatic diamine dissolved in a solvent containing at least 10% of a co-solvent boiling above 220.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.