Resin composition and plated article thereof
US4612253A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 1985 |
| Grant date | Sep 16, 1986 |
| Priority date | — |
| Expiry date | Mar 15, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31931
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed is a wet-platable acrylonitrilebutadiene-styrene resin (ABS resin) composition comprising 100 parts by weight of an ABS resin and 0.1 to 10 parts by weight of a compound represented by the following general formula [I]: ##STR1## wherein R.sub.1 stands for an alkyl group, R.sub.2 and R.sub.3 each stand for a hydrogen atom or a methyl group, R.sub.4 and R.sub.5 stand for a hydrogen atom or a group --C(O)R.sub.6 in which R.sub.6 stands for an alkyl group, and m and n are integers of from 1 to 20. A plated resin article having an improved plating adhesion can be obtained by wet-plating a molded article formed from this ABS resin composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.