Superplastic alloys formed by electrodeposition
US4613388A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 17, 1982 |
| Grant date | Sep 23, 1986 |
| Priority date | — |
| Expiry date | Sep 17, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S420/902
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
There are provided superplastic alloys formed by electrodeposition of the alloy onto a cathode from an electrolyte containing a first metal ion, which is iron, nickel or cobalt, and a second constituent different from the first, which is iron, nickel, cobalt, tungsten or molybdenum, or a colloidal dispersoid. The products formed are fine-grain deposits free of intergranular embrittling films, and exhibit grain boundary flow at a superplastic temperature below a recrystallization temperature of the deposit. Nickel-cobalt alloys are preferred, and are deposited from halide-free sulfamate baths, with care being taken to eliminate all anode oxides from the system. In a complex structure, the approximate initial hardware contour is formed by electrodeposition, and the final structure formed by superplastic forming.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.