High-speed silver plating and baths therefor
US4614568A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 4, 1984 |
| Grant date | Sep 30, 1986 |
| Priority date | — |
| Expiry date | Jun 4, 2004 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/46
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A high-speed silver plating solution for electroplating silver on a substrate which consists of a less-noble metal, such as copper, copper alloy, copper-plated base metal, iron, ferroalloy, nickel, or nickel alloy, characterized in that a cyclic compound whose ring includes a thioureylene radical ##STR1## (in which R.sub.1 and R.sub.2 are hydrogen or an alkyl or aryl group each) is added to the solution in a sufficient amount to prevent silver deposition by displacement reaction, whereby the silver deposition on the substrate is avoided. There is also provided a pretreating solution including the aforementioned compound for dipping the substrate prior to the silver plating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.