Heat resistant resin composition
US4614782A · kind A · utility
7Cited by
2References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 23, 1984 |
| Grant date | Sep 30, 1986 |
| Priority date | — |
| Expiry date | Nov 23, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B3/306
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A heat resistant resin composition comprising (A) a polyamideimide resin soluble in a cresol type solvent obtained by using a lactam as a reactant, and (B) at least one member selected from the group consisting of a polyester resin, a polyesteramide resin, a polyesterimide resin and a polyesteramideimide resin, preferably heated for conducting a reaction, gives coatings excellent in heat resistance, thermal shock resistance, wear resistance, resistance to hydrolysis, crazing resistance, etc., suitable for enamelled wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.