Plastics encapsulated electronic devices
US4614963A · kind A · utility
4Cited by
2References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 18, 1983 |
| Grant date | Sep 30, 1986 |
| Priority date | — |
| Expiry date | Nov 18, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/239
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The plastic encapsulation material covering an integrated circuit is impregnated with a corrosion inhibitor evenly dispensed throughout the material. This inhibits the corrosion of the metallization on the surface of the integrated circuit thus prolonging the life of the device particularly under adverse environmental conditions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.