Spring finger interconnect for IC chip carrier
US4615573A · kind A · utility
51Cited by
5References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 1, 1985 |
| Grant date | Oct 7, 1986 |
| Priority date | — |
| Expiry date | Nov 1, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49149
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Apparatus and method for electrically interconnecting two integrated circuit boards, which includes spring finger contact pads positioned on one board which are matched to raised contact pads on a second board in a manner such that the assembly is easily disassembled and reconnectable and such that it provides for exact height registration between boards. Accurate height registration is required when, for example, an electro-optical device referenced with respect to an optical system is mounted on one of the circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.