Contact assembly for small semiconductor device
US4616250A · kind A · utility
7Cited by
4References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 7, 1985 |
| Grant date | Oct 7, 1986 |
| Priority date | — |
| Expiry date | Jan 7, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A resilient contact assembly for contacting a semiconductor device comprises a center segment and first and second side segments. The center segment has an open-ended pocket in the end thereof for receiving, positioning and supporting the semiconductor device. The ends of the side segment are bent out of the plane of the center segment and first and second contact arms extend therefrom towards said pocket to contact the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.