Epoxy resin composition for cast molding
US4617330A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 1985 |
| Grant date | Oct 14, 1986 |
| Priority date | — |
| Expiry date | Mar 28, 2005 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K13/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition for cast molding which comprises: PA0 (A) an epoxy resin; PA0 (B) a curing agent; PA0 (C) cut fibers having distributions of 3 to 20 .mu.m in diameter and 3 to 1500 .mu.m in length; PA0 (D) inorganic powder having a size distribution of particles with 90% by weight or more of particles with particle sizes of 10 .mu.m or less and 50% by weight or more of particles with particle sizes of 5 .mu.m or less, the total amount of the components (C) and (D) formulated being 40 to 225 parts by volume per 100 parts by volume of the total amount of the components (A) and (B) formulated displays excellent crack resistance, strength as well as a low shrinkage characteristic and, good fluidity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.