Infrared focal plane module with stacked IC module body
US4618763A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 12, 1985 |
| Grant date | Oct 21, 1986 |
| Priority date | — |
| Expiry date | Apr 12, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An infrared detection module is disclosed for interfacing a plurality of detector elements to external electronics. The module is formed of a plurality of multi-channel integrated circuits stacked in substantially overlapping registry with adjacent integrated circuits separated by an insulating layer. Each integrated circuit is formed to have exposed conductive areas along first and second edge portions thereof. Each detector array segment is disposed transverse to the plane of the integrated circuits and connected to conductive areas on each integrated circuit along first edge portions thereof. A module header interface is disposed transverse to the plane of the integrated circuits and is electrically connected to the conductive areas along the integrated circuit second edge portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.