Heat transfer apparatus
US4619316A · kind A · utility
80Cited by
1References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 24, 1985 |
| Grant date | Oct 28, 1986 |
| Priority date | — |
| Expiry date | Apr 24, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S505/90
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
In an apparatus wherein heat generating bodies such as integrated circuit chips are cooled by utilizing boiling of a liquid; a heat transfer apparatus characterized in that a heat conductive member which has a plurality of layers of cavity groups and apertures for bringing the cavity groups into communication is installed on a surface of each of the heat generating bodies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.