Process for etching via holes in alumina
US4619731A · kind A · utility
4Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 1985 |
| Grant date | Oct 28, 1986 |
| Priority date | — |
| Expiry date | Oct 29, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4629
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Via holes are etched in an alumina layer using an etchant bath of ethylenediaminetetraacetic acid at a pH above 9.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.