Copper foil for printed circuit board
US4619871A · kind A · utility
21Cited by
7References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 15, 1984 |
| Grant date | Oct 28, 1986 |
| Priority date | — |
| Expiry date | Nov 15, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1291
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A copper foil resistant to acids and heat and yet easy to etch is obtained by forming a cobalt layer containing molybdenum and/or tungsten on the bonding surface thereof. Roughening of the foil surface prior to formation of the layer provides highly peel-resistant bonding of the foil thereat to resin-containing substrates of the type found in typical printed circuit boards. The provision of a chromate layer on the cobalt further improves the adhesion between the copper foil and resin-containing substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.