Solid-transformation thermal resist
US4619894A · kind A · utility
21Cited by
16References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 12, 1985 |
| Grant date | Oct 28, 1986 |
| Priority date | — |
| Expiry date | Apr 12, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/168
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A negative resist and masking process for microfabrication comprising an evaporated film of aluminum and oxygen which, in the as-deposited state, is highly conductive and has low resistance to etching, but when exposed to active radiation, such as by pulse laser thermal excitation, converts to a low electrical conductivity, high etchant resistive phase.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.