Integrated circuit packaging systems with double surface heat dissipation
US4620215A · kind A · utility
68Cited by
10References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 9, 1985 |
| Grant date | Oct 28, 1986 |
| Priority date | — |
| Expiry date | Oct 9, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A mounting arrangement for a semiconductor integrated circuit chip having a first heat sink mounted to the bottom surface of the chip in good heat transfer relation and a second heat sink mounted to a region of the top surface of the chip interior to the bonding pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.