Device for attaching modular electronic components to or removing them from an insulative substrate
US4620659A · kind A · utility
22Cited by
3References
1Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 2, 1984 |
| Grant date | Nov 4, 1986 |
| Priority date | — |
| Expiry date | Apr 2, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/34
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention is a device for attaching or removing electronic components from a substrate and includes a nozzle for delivering heat to the terminal areas of the substrate. The nozzle includes a first plate, spaced from the component, having openings corresponding to the terminals of the component. The nozzle further includes a second portion below the plate for directing heated fluid to the component. Further, at least one opening in the plate is enlarged to delivery more heat to certain terminals connected to a ground plate, for example.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.