Vacuum pick for semiconductor wafers
US4620738A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 19, 1985 |
| Grant date | Nov 4, 1986 |
| Priority date | — |
| Expiry date | Aug 19, 2005 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65G47/91
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A vacuum pick suitable for removing semiconductor wafers from and replacing wafers in a cassette holder. The vacuum pick includes a thin profile housing having a wafer support surface with a cavity therein, a resilient, flexible member covering a portion of the cavity to form an enclosure, and a rigid chuck mounted on the flexible member so as to permit movement of the chuck relative to the housing. The chuck includes a wafer-receiving surface connected through a passage to the enclosure. When a vacuum is applied to the enclosure, the wafer and the chuck are retracted against the housing and held firmly in place. The chuck tilts relative to the housing when it contacts a tilted wafer, thereby insuring reliable attachment to the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.