High density chip socket
US4620761A · kind A · utility
52Cited by
5References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 30, 1985 |
| Grant date | Nov 4, 1986 |
| Priority date | — |
| Expiry date | Jan 30, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00013
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An interconnection system for high density I/O sites on an I.C. Interconnection substrate allowing field replacement thereof has a socket body with an array of contact springs adapted to be removably biased into engagement with conductive pads on the bottom surface of the substrate. The contact springs have a tail portion depending from the socket body which are affixed to a printed board. The substrate is locked into place on the socket body by removable latches.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.