Apparatus for the plasma treatment of disk-shaped substrates
US4620893A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 28, 1985 |
| Grant date | Nov 4, 1986 |
| Priority date | — |
| Expiry date | Feb 28, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/34
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus for plasma treatment of plate-shaped substrates comprises a reaction vessel (2) provided with supply opening (48) and discharge opening (50) for a reaction gas. Anode (46) and a plurality of cathodes (13) are also provided. At the periphery of the cathodes (13) are provided gas flow passges (40, 41) through which the reaction gas may flow from the gas supply opening (48). The gas flow passages (40, 41) are provided on the side of surfaces (15c, 16c) of the cathodes receiving small plates. Discharge opening (50) is arranged downstream of gas flow passages (40, 41). The apparatus may also comprise a removable tray (38) to load and unload the small plates, and the flow passages (40, 41) may be delimited by the walls of the electrodes and of passages traversing the tray (38).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.