Low temperature fired ceramics
US4621066A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 1985 |
| Grant date | Nov 4, 1986 |
| Priority date | — |
| Expiry date | Mar 27, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4629
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Low temperature fired ceramics produced by firing at a low temperature a mixture consisting of, in weight percentages: PA1 (a) 50 to 65% of powder glass consisting of 10 to 55% of CaO, 45 to 70% of SiO.sub.2, 0 to 30% of Al.sub.2 O.sub.3 and up to 10% of impurities; and PA1 (b) 50 to 35% of powder Al.sub.2 O.sub.3 containing up to 10% of impurities. The glass component (a) may further contains B.sub.2 O.sub.3 up to 20% based on the total weight of the former glass-forming components. The ceramics exhibit excellent thermal conductivity, high mechanical strength, low thermal expansion and small dielectric constant and such advantageous combination of properties make them useful in many applications, more especially highly suited to the use as substrate of various electronic parts, components or multilayer integrated circuits. Also, since the ceramics can be prepared at lower firing temperatures and a higher heating rate, the production cost and time can be advantageously saved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.