Wafer die construction
US4621997A · kind A · utility
10Cited by
3References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 23, 1985 |
| Grant date | Nov 11, 1986 |
| Priority date | — |
| Expiry date | Sep 23, 2005 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA21C11/08
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An apparatus for manufacturing wafers is disclosed that includes a pair of rolls each containing cavities that form the wafers. The cavities each have outer edge walls that extend from the bottom portion of the cavity at an obtuse angle and the two rolls are arranged so that the cavities become effectively mirror images of each other as they engage at the nip. The cavities also have portions rising from the bottom thereof that impress a design substantially equal from both sides to proclude warping of the bread.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.