Catalyst composition for forming electroless plating on ceramics
US4622069A · kind A · utility
37Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 15, 1985 |
| Grant date | Nov 11, 1986 |
| Priority date | — |
| Expiry date | Nov 15, 2005 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/1889
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A composition for forming electroless plating on ceramics which comprises (i) 1 weight part of at least one member selected from the group consisting of organic palladium compounds and organic silver compounds, (ii) 0.1 to 200 weight parts of at least one member selected from the group consisting of organic metal compounds, (iii) 10 to 1000 weight parts of an organic solvent and optionally (iv) 1 to 500 weight parts of at least one member selected from the group consisting of high molecular compounds and particulate inorganic substances.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.