Decoupling capacitor and method of manufacture thereof
US4622619A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 13, 1985 |
| Grant date | Nov 11, 1986 |
| Priority date | — |
| Expiry date | Mar 13, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/435
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A decoupling capacitor and method of manufacture thereof are presented wherein the decoupling capacitor is formed from a lead frame which contains the four leads of the capacitor (two of which are electrically inactive) on a single plane. The use of a lead frame automatically provides the dimensional tolerances necessary for encapsulation molding of the decoupling capacitor. The decoupling capacitor is a hermetically sealed capacitive unit consisting of a multilayer monolithic ceramic capacitor (for higher capacitance values in combination with other desirable properties such as flat capacitance vs. temperature characteristics), active leads bonded to the capacitor and dummy pins for auto-insertion into printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.