Method of mounting a plurality of coupons in molded material and polishing surfaces thereof for cross-sectional analysis of printed circuit boards
US4623500A · kind A · utility
7Cited by
1References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 18, 1985 |
| Grant date | Nov 18, 1986 |
| Priority date | — |
| Expiry date | Apr 18, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0044
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Method and apparatus for high volume preparation of cross-sectional specimens of printed circuit boards for microscopic examination, including a method and apparatus for precision mounting of a large number of such cross sections in a single molding sequence for simultaneous polishing of such cross sections in a single polishing operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.