Moulding materials
US4623691A · kind A · utility
1Cited by
6References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 1985 |
| Grant date | Nov 18, 1986 |
| Priority date | — |
| Expiry date | May 1, 2005 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2361/20
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An amino-formaldehyde moulding composition is made by compounding together PA0 an aqueous amino-formaldehyde resin solution to provide 0 to 90 percent by weight of the resin component of the composition, filler to make up 20 to 60 percent by weight of the moulding composition and PA0 UF resin which had a low degree of condensation, is solid at room temperature, contains a modifier and makes up 4 to 80 percent by weight of the moulding composition. The moulding compositions themselves are also claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.