Patent · US Expired

Probe device for testing an integrated circuit

US4623839A · kind A · utility

38Cited by
2References
17Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 15, 1983
Grant dateNov 18, 1986
Priority date—
Expiry dateSep 15, 2003

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49149
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A plurality of probes for contacting the pads of an integrated circuit are cantilevered within the aperture of a ceramic ring. The probes are fixed to the ring with an adhesive and a second ceramic ring is positioned on them to support them against contact forces. The probes are soldered to conductive tracks on the first ring for connection to test apparatus, providing a very rigid and dimensionally accurate and stable probe arrangement. The device can be constructed with the probes in contact with a sample integrated circuit, in a quick and simple process.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.