Diamond saw
US4624237A · kind A · utility
31Cited by
10References
11Claims
0Family size
Inventor
Key dates
| Filing date | Feb 28, 1985 |
| Grant date | Nov 25, 1986 |
| Priority date | — |
| Expiry date | Feb 28, 2005 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28D1/121
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A diamond saw for cutting hard materials, in which a steel plate is fixed with a sintered abrading body consisting of diamond abrasive granules and a bonding metal powder, characterized in that a plurality of grooves are provided on the surface of both the front and back side faces of the sintered abrading body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.