Process for the autopositioning of an interconnection line on an electric contact hole of an integrated circuit
US4624864A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 13, 1985 |
| Grant date | Nov 25, 1986 |
| Priority date | — |
| Expiry date | Jun 13, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76838
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This process consists of depositing a first conductive coating on the complete circuit, depositing on said coating a filling material used for filling the contact hole, the surface of said material being substantially planar, carrying out an anisotropic etching of said filling material so as to expose those parts of the first conductive coating located outside the contact hole and only retaining that part of said filling material which fills the contact hole, depositing on the structure obtained a second conductive coating in which the interconnection line will be formed, producing in the second conductive coating a resin mask used for defining the dimensions of the line, eliminating those parts of the second and first conductive coatings which are free from the mask and eliminating the mask.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.