Thermally transferable layers of radiation sensitive epoxy resins used to prepare protective coatings and relief images
US4624912A · kind A · utility
91Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 6, 1985 |
| Grant date | Nov 25, 1986 |
| Priority date | — |
| Expiry date | Feb 6, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0079
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A process for the production of a protective layer or a relief image on a substrate, wherein a radiation-sensitive layer, consisting of a solid film-forming epoxy resin containing a photoinitiator, which can be activated by radiation, for the polyaddition reaction, is transferred from a support to a substrate, then exposed directly or under a photomask and hardened by the action of heat, after which, if appropriate, the unexposed parts are developed with a solvent. The process is suitable, for example, for the production of printed circuits, solder resist masks and offset printing plates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.