Patent · US Expired

Multi-layer electrical support substrate

US4625228A · kind A · utility

4Cited by

5References

14Claims

0Family size

Assignee

W. C. Heraeus GmbH · DE

Inventors

Albrecht Bischoff · Bruchköbel, DE
Holger Eisentraut · Langenselbold, DE
Joachim Schmidt · Schlangen, DE

Key dates

Filing date	Oct 17, 1984
Grant date	Nov 25, 1986
Priority date	—
Expiry date	Oct 17, 2004

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

To prevent defoliation or splitting-off of an aluminum or aluminum alloy which is roll-plated on a copper or copper alloy base, an intermediate nickel layer having less than 0.05% contaminants is applied beneath the aluminum layer. If the base is a copper alloy, an intermediate copper layer which is of an oxygen-free copper or copper alloy is placed between the base and the nickel layer. Typical dimensions are: base copper layer (1, 13): 0.25 mm; oxygen-free copper layer (7, 15): 0.005 to 0.01 mm; nickel layer with less than 0.05% contaminants or impurities: about 0.01 mm; AlSi 0.5 aluminum alloy: 0.005 to 0.006 mm.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.