Arrangement for permitting rapid cooling of an electronic component operable at low temperatures
US4625229A · kind A · utility
9Cited by
7References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 12, 1984 |
| Grant date | Nov 25, 1986 |
| Priority date | — |
| Expiry date | Oct 12, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48247
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
The invention relates to an arrangement for an electronic component operable at low temperatures, in particular, to a radiation sensitive semiconductor component. The arrangement consists of a housing for the component and of a cooler which is in communication with the housing and operates in accordance with the Joule-Thomson effect. The invention consists in that there is arranged between the cooler and the adjacent housing wall a super-insulation comprised of a single- or multi-layered foil with low thermal conductivity and capacity and high thermal-transfer resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.