Selective bonding interconnection mask
US4626309A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 1984 |
| Grant date | Dec 2, 1986 |
| Priority date | — |
| Expiry date | Jul 2, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24331
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An interconnection mask which is sandwiched between two members to be bonded together is comprised of a thin sheet of preselected material which has a plurality of apertures therein which are positioned, sized, and shaped to define the common bonding areas between the two members whereby structural failures induced by bonding and loading characteristics of the two members are minimized. A method for making an apparatus which utilizes the interconnection mask comprises the steps of preparing a mask of preselected material having a plurality of apertures therein, each aperture being positioned, sized and shaped to define a common bonding area between first and second members of the apparatus whereby the structural failures induced by the bonding and loading characteristics of the two members are minimized; placing a layer of bonding material on a surface of the first member; placing the interconnection mask over the layer of bonding material; placing the second member over the mask; bonding the first and second members together at each common bonding area defined by the apertures in the mask.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.